The machine is suitable for temporary storage of polymerization chemical reactions after circuit exposure or solder mask exposure. It can remain stationary for 15 minutes after exposure and be directly connected to the develop machine,reduced the footprint of the static placement board and the scratches caused by moving the board after exposure , improving the utilization rate Pressure / of the site and product yield,It also enables automatic connection between exposure machine and develop machine achieving factory automation in production
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90 PNLS Vertical Flip Buffer
| ITEM | Specification parameters |
|---|---|
| Conveying inner width | 860 mm |
| Max.PCB Size | W730 x L625 mm |
| Min.PCB Size | W400 x L300 mm |
| PCB Thickness | 0.2-3.2mm |
| Pressure | / |
| Power Supply | AC380V,2KW |
| Speed | 6-8 Pnls/Min |
| Buffer Qty | 90 Pnls |
| Convey axle | 304 |
| Frame | Carbon steel welding+baking paint |
| Dimension | L2400xW2055xH2650mm |
| Weight | 1500KG |
| PLC | Mitsubishi |
| HMI | WEINVIEW |
| Photoelectric switch | PEPPERL+FUCHS /FOTEK/Autonics |
| Electrical components | CHNT、IDEC… |
| Motor | FT/DEB |
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